More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Buch
- Herausgeber: Francis Balestra, Francesca Iacopi
- Springer International Publishing, 02/2024
- Einband: Kartoniert / Broschiert, Paperback
- Sprache: Englisch
- ISBN-13: 9783031216121
- Bestellnummer: 11769323
- Umfang: 276 Seiten
- Nummer der Auflage: 24001
- Auflage: 1st ed. 2023
- Gewicht: 423 g
- Maße: 235 x 155 mm
- Stärke: 16 mm
- Erscheinungstermin: 18.2.2024
Achtung: Artikel ist nicht in deutscher Sprache!
Weitere Ausgaben von More-than-Moore Devices and Integration for Semiconductors
Klappentext
This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems.Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems;
Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources;
Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.