Chong Leong Gan: Electronic Materials Innovations and Reliability in Advanced Memory Packaging, Gebunden
Electronic Materials Innovations and Reliability in Advanced Memory Packaging
Buch
deliverable within 2-3 weeks (if available from supplier)
Current price: EUR 164.28
Shipping
(United States of America): EUR 19.90
- Publisher:
- Springer, 07/2025
- Binding:
- Gebunden
- Language:
- Englisch
- ISBN-13:
- 9783031947940
- Item number:
- 12373820
- Volume:
- 196 Pages
- Weight:
- 463 g
- Format:
- 241 x 160 mm
- Thickness:
- 17 mm
- Release date:
- 22.7.2025
- Note
-
Caution: Product is not in German language
Blurb
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).
The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
